Optimization and characterization of waf
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Till Huesgen; Gabriel Lenk; BjΓΆrn Albrecht; Paul Vulto; Thomas Lemke; Peter Woia
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Article
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2010
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Elsevier Science
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English
β 501 KB
A wafer-level adhesive bonding process based on Ordyl SY300, an acrylic permanent dry-film photoresist, is systematically optimized and characterized. Silicon and Pyrex wafers are bonded with a structured 120 m thick layer of Ordyl. A bond yield of 95% and a tensile bond strength of 13.36 MPa are me