ChemInform Abstract: Electrochemistry of Chemical Vapor Deposited Tungsten Films with Relevance to Chemical Mechanical Polishing.

✍ Scribed by E. A. KNEER; C. RAGHUNATH; S. RAGHAVAN; J. S. JEON

• Publisher: John Wiley and Sons
• Year: 2010
• Weight: 27 KB
• Volume: 28
• Category: Article
• ISSN: 0931-7597
• DOI: 10.1002/chin.199714022

✦ Synopsis

Electrochemistry of Chemical Vapor Deposited Tungsten Films with Relevance to Chemical Mechanical Polishing.

-The passivation and etching behavior of CVD tungsten films under acidic conditions relevant to chemical mechanical polishing is studied by electrochemical and XPS methods. According to dc potentiodynamic polarization results, a passive layer which inhibits W dissolution is present on the W surface in the pH range 2-11. Best passivation is provided by the passive layer formed at pH 2. The passivation decreases rapidly as the solution becomes more alkaline. The passive layer, the thickness and passivity of which increases with a decrease from pH 4 to pH 2, consists of a WO2/WO3 duplex oxide layer. Upon H2O2 addition to solutions of pH 2 and 4, the dissolution of W increases dramatically. -(KNEER, E. A.;