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Characteristics of WN Diffusion Barrier Layer for Copper Metallization

✍ Scribed by Kwak, M. Y. ;Shin, D. H. ;Kang, T. W. ;Kim, K. N.

Publisher
John Wiley and Sons
Year
1999
Tongue
English
Weight
96 KB
Volume
174
Category
Article
ISSN
0031-8965

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