Electrical characterization of reactively sputtered TiN diffusion barrier layers for copper metallization

✍ Scribed by C. Kaufmann; J. Baumann; T. Gessner; T. Raschke; M. Rennau; N. Zichner

• Publisher: Elsevier Science
• Year: 1995
• Tongue: English
• Weight: 513 KB
• Volume: 91
• Category: Article
• ISSN: 0169-4332
• DOI: 10.1016/0169-4332(95)00133-6