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Barrier layer effect of titanium-tungsten on the electromigration in sputtered copper films on polyimide

โœ Scribed by Hsueh-Wen Wang; Bi-Shiou Chiou


Book ID
110271962
Publisher
Springer US
Year
2000
Tongue
English
Weight
291 KB
Volume
11
Category
Article
ISSN
0957-4522

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