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Barrier layer effect of tantalum on the electromigration in sputtered copper films on hydrogen silsesguioxane and SiO2

โœ Scribed by Wen-Li Sung; Bi-Shiou Chiou


Book ID
107452775
Publisher
Springer US
Year
2002
Tongue
English
Weight
292 KB
Volume
31
Category
Article
ISSN
0361-5235

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