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Curing of polyimide and the effect of the TEOS SiO2barrier layer on the electromigration of sputtered Cu with polyimide passivation

✍ Scribed by Hanyi Hung; Bi-Shiou Chiou


Book ID
107452831
Publisher
Springer US
Year
2002
Tongue
English
Weight
176 KB
Volume
31
Category
Article
ISSN
0361-5235

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The effect of curing history on the residual stress behaviors in semiflexible structure poly(4,4Ј-oxydiphenylene pyromellitimide) (PMDA-ODA) and rigid structure poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) polyimide was investigated. Depending upon the curing history and different structure