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Automated vision system for inspection of IC pads and bonds

✍ Scribed by Sreenivasan, K.K.; Srinath, M.; Khotanzad, A.


Book ID
114560439
Publisher
IEEE
Year
1993
Tongue
English
Weight
719 KB
Volume
16
Category
Article
ISSN
0148-6411

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## Abstract We describe a novel inspection system based on the application of the stereo technique to the detection of defects related to the three‐dimensional (3D) profile of IC wire bonds. In our single‐camera–based setup, stereo views are obtained by rotating the IC chip under the CCD camera wit