## Abstract We describe a novel inspection system based on the application of the stereo technique to the detection of defects related to the threeβdimensional (3D) profile of IC wire bonds. In our singleβcameraβbased setup, stereo views are obtained by rotating the IC chip under the CCD camera wit
β¦ LIBER β¦
Design and development of a new machine vision wire bonding inspection system
β Scribed by Der-Baau Perng; Cheng-Chuan Chou; Shu-Ming Lee
- Book ID
- 105851861
- Publisher
- Springer
- Year
- 2006
- Tongue
- English
- Weight
- 637 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0268-3768
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