Real-time Analysis of an IC Wire-bonding Inspection System T hough the need to consider all aspects of real-time in the development of a system is not new to control engineers, they are relatively new to the machine vision specialists, especially as they tend to come from various dierent backgrounds
A stereo vision system for the inspection of IC bonding wires
β Scribed by Q. Z. Ye; S. H. Ong; X. Han
- Publisher
- John Wiley and Sons
- Year
- 2000
- Tongue
- English
- Weight
- 199 KB
- Volume
- 11
- Category
- Article
- ISSN
- 0899-9457
- DOI
- 10.1002/ima.1010
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β¦ Synopsis
Abstract
We describe a novel inspection system based on the application of the stereo technique to the detection of defects related to the threeβdimensional (3D) profile of IC wire bonds. In our singleβcameraβbased setup, stereo views are obtained by rotating the IC chip under the CCD camera with a telecentric lens. The edges of the wires are detected using Petrou's line filter and the facet model applied to obtain subpixel edge localization. After linking edges to form meaningful curves, stereo matching is conducted between the two curve lists of a stereo pair. The height profiles of the wire bonds are obtained using the disparity equation derived from the imaging geometry. Β© 2001 John Wiley & Sons, Inc. Int J Imaging Syst Technol 11, 254β262, 2000
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