β Scribed by Hiroyuki Tsukahara; Masato Nakashima; Takehisa Sugawara
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
## Abstract We describe a novel inspection system based on the application of the stereo technique to the detection of defects related to the threeβdimensional (3D) profile of IC wire bonds. In our singleβcameraβbased setup, stereo views are obtained by rotating the IC chip under the CCD camera wit
Real-time Analysis of an IC Wire-bonding Inspection System T hough the need to consider all aspects of real-time in the development of a system is not new to control engineers, they are relatively new to the machine vision specialists, especially as they tend to come from various dierent backgrounds
The main functions of special automated system for airframe inspection problem development and a numerical example are described. Parameters of fatigue cracks growth model should be estimated by processing of airframe full-scale fatigue test results. For the choice of periodicity a minimax solution