𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

✍ Scribed by Jeong-Won Yoon; Hyun-Suk Chun; Ja-Myeong Koo; Seung-Boo Jung

Publisher
Springer-Verlag
Year
2006
Tongue
English
Weight
452 KB
Volume
13
Category
Article
ISSN
0946-7076

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructural characterization of Au/S
Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications
✍ D.G. Ivey 📂 Article 📅 1998 🏛 Elsevier Science 🌐 English ⚖ 554 KB

A~tract--Preliminary results on the feasibility of using co-evaporation of eutectic Au/Sn solder for semiconductor packaging are presented. Gold is electron beam evaporated, while Sn is thermally evaporated, onto Ti/Pt/Au metallized InP substrates. Electron microscopy is utilized to determine the co