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Adhesive wafer bonding with photosensitive polymers for MEMS fabrication

✍ Scribed by Erkan Cakmak; Viorel Dragoi; Elliott Capsuto; Craig McEwen; Eric Pabo

Book ID
106185845
Publisher
Springer-Verlag
Year
2009
Tongue
English
Weight
385 KB
Volume
16
Category
Article
ISSN
0946-7076

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✍ Till Huesgen; Gabriel Lenk; BjΓΆrn Albrecht; Paul Vulto; Thomas Lemke; Peter Woia πŸ“‚ Article πŸ“… 2010 πŸ› Elsevier Science 🌐 English βš– 501 KB

A wafer-level adhesive bonding process based on Ordyl SY300, an acrylic permanent dry-film photoresist, is systematically optimized and characterized. Silicon and Pyrex wafers are bonded with a structured 120 m thick layer of Ordyl. A bond yield of 95% and a tensile bond strength of 13.36 MPa are me