Adhesive bonding with SU-8 at wafer level for microfluidic devices
β Scribed by Yu, Liming; Tay, Francis E H; Xu, Guolin; Chen, Bangtao; Avram, Marioara; Iliescu, Ciprian
- Book ID
- 118175322
- Publisher
- Institute of Physics
- Year
- 2006
- Tongue
- English
- Weight
- 267 KB
- Volume
- 34
- Category
- Article
- ISSN
- 1742-6588
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This paper describes a method for fabricating capacitive pressure sensors through the use of adhesive bonding with SU-8 in a vacuum. The influence of different parameters on the bonding of structured wafers was investigated. It was found that pre-bake time, pumping time, and the thickness of the cro
A wafer-level adhesive bonding process based on Ordyl SY300, an acrylic permanent dry-film photoresist, is systematically optimized and characterized. Silicon and Pyrex wafers are bonded with a structured 120 m thick layer of Ordyl. A bond yield of 95% and a tensile bond strength of 13.36 MPa are me