✦ LIBER ✦
Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs
✍ Scribed by Frank Niklaus; Adit Decharat; Fredrik Forsberg; Niclas Roxhed; Martin Lapisa; Michael Populin; Fabian Zimmer; Jörn Lemm; Göran Stemme
- Book ID
- 108263006
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 894 KB
- Volume
- 154
- Category
- Article
- ISSN
- 0924-4247
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