Adhesion studies in integrated circuit interconnect structures

✍ Scribed by J.M. Molina-Aldareguia; I. Ocaña; D. González; M.R. Elizalde; J.M. Sánchez; J.M. Martínez-Esnaola; J. Gil-Sevillano; T. Scherban; D. Pantuso; B. Sun; G. Xu; B. Miner; J. He; J. Maiz

• Book ID: 108123148
• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 328 KB
• Volume: 14
• Category: Article
• ISSN: 1350-6307
• DOI: 10.1016/j.engfailanal.2006.02.008