✦ LIBER ✦
Calibration of MEMS-based test structures for predicting thermomechanical stress in integrated circuit interconnect structures
✍ Scribed by J. Dos-santos; Kai Wang; A. Horsfall; J. Pina; N. Wright; A. O'neill; S. Soare; S. Bull; J. Terry; A. Walton; A. Gundlach; J. Stevenson
- Book ID
- 126681905
- Publisher
- IEEE
- Year
- 2005
- Tongue
- English
- Weight
- 459 KB
- Volume
- 5
- Category
- Article
- ISSN
- 1530-4388
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