✦ LIBER ✦
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits
✍ Scribed by Kamiya, Shoji; Shishido, Nobuyuki; Watanabe, Shinsuke; Sato, Hisashi; Koiwa, Kozo; Omiya, Masaki; Nishida, Masahiro; Suzuki, Takashi; Nakamura, Tomoji; Nokuo, Takeshi; Nagasawa, Tadahiro
- Book ID
- 123570002
- Publisher
- Elsevier Science
- Year
- 2013
- Tongue
- English
- Weight
- 913 KB
- Volume
- 215
- Category
- Article
- ISSN
- 0257-8972
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