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Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy

✍ Scribed by Eunmi Choi,Hee Soo Choi,Areum Kim,Seon Jea Lee…

Book ID: 126367503
Publisher: TechnoPress
Year: 2013
Tongue: English
Weight: 834 KB
Volume: 19
Category: Article
ISSN: 1598-9623
DOI: 10.1007/s12540-013-0636-y

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