๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Addressing the challenges of advanced packaging and interconnection

โœ Scribed by Herrell, D.J.


Book ID
117878185
Publisher
IEEE
Year
1993
Tongue
English
Weight
927 KB
Volume
13
Category
Article
ISSN
0272-1732

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๐Ÿ“œ SIMILAR VOLUMES


Packaging and interconnection of sensors
โœ H. Reichl ๐Ÿ“‚ Article ๐Ÿ“… 1990 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 679 KB

Chip mounting methods, chip-substrate mterconnectlon techniques, encapsulation processes, design methods and technolo@es for multi-chip systems must all be considered m mlcroelectromc packagmg In the case of sensors, as well as the electrical contacts for signal outputs and power dlstnbutlon, the in