Packaging and interconnection of sensors
โ
H. Reichl
๐
Article
๐
1990
๐
Elsevier Science
๐
English
โ 679 KB
Chip mounting methods, chip-substrate mterconnectlon techniques, encapsulation processes, design methods and technolo@es for multi-chip systems must all be considered m mlcroelectromc packagmg In the case of sensors, as well as the electrical contacts for signal outputs and power dlstnbutlon, the in