Packaging and interconnection of sensors

✍ Scribed by H. Reichl

• Publisher: Elsevier Science
• Year: 1990
• Tongue: English
• Weight: 679 KB
• Volume: 25
• Category: Article
• ISSN: 0924-4247
• DOI: 10.1016/0924-4247(90)87010-g

✦ Synopsis

Chip mounting methods, chip-substrate mterconnectlon techniques, encapsulation processes, design methods and technolo@es for multi-chip systems must all be considered m mlcroelectromc packagmg In the case of sensors, as well as the electrical contacts for signal outputs and power dlstnbutlon, the input of the non-electrical measurement ngnals must be reahzed Parts of the sensor are therefore m direct contact mth envlronmental physical and chemical parameters which can degrade the rehablhty Therefore the reqmrements for sensor packaging technologes are related to specific measurement problems In general, sensor packagmg has to deliver rehable, economical and apphcatlon-onented solutions by choosing optimal technologies and matenal combmatlons