✦ LIBER ✦

Optoelectronic interconnections and packaging: A materials challenge

✍ Scribed by Darrel Frear

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Packaging for optoelectronic interconnec

✍ Robert A. Boudreau 📂 Article 📅 1994 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 985 KB

Integrated optoelectronic materials and

✍ L. D. Hutcheson 📂 Article 📅 1989 🏛 Springer US 🌐 English ⚖ 721 KB

Addressing the challenges of advanced pa

✍ Herrell, D.J. 📂 Article 📅 1993 🏛 IEEE 🌐 English ⚖ 927 KB

Materials for high-density electronic pa

📂 Article 📅 1991 🏛 Elsevier Science ⚖ 470 KB

Thin Film Packaging and Interconnections

✍ Martin, H. 📂 Article 📅 1963 🏛 IEEE 🌐 English ⚖ 578 KB

Interconnections-addressing the next cha

✍ Schutt-Aine, J.E.; Sung-mo Kang 📂 Article 📅 2001 🏛 IEEE 🌐 English ⚖ 24 KB