Interconnections-addressing the next challenge of IC technology (part I: integration and packaging trends)

✍ Scribed by Schutt-Aine, J.E.; Sung-mo Kang

• Book ID: 118694448
• Publisher: IEEE
• Year: 2001
• Tongue: English
• Weight: 24 KB
• Volume: 89
• Category: Article
• ISSN: 0018-9219
• DOI: 10.1109/jproc.2001.920574