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A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

✍ Scribed by Hui Shun Chin; Kuan Yew Cheong; Ahmad Badri Ismail

Book ID: 107451846
Publisher: The Minerals, Metals & Materials Society
Year: 2010
Tongue: English
Weight: 482 KB
Volume: 41
Category: Article
ISSN: 1543-1916
DOI: 10.1007/s11663-010-9365-5

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