A review of nitrogen trifluoride for dry etching in microelectronics processing
β Scribed by Bogdan Golja; John A. Barkanic; Andrew Hoff
- Publisher
- Elsevier Science
- Year
- 1985
- Tongue
- English
- Weight
- 804 KB
- Volume
- 16
- Category
- Article
- ISSN
- 0026-2692
No coin nor oath required. For personal study only.
β¦ Synopsis
The development of new gases for dry etching is important if submicron device geometries are to be realized. Gases which are currently in use for the various proce~__sing steps associated with device fabrication include CF4, CF4/O2, SF6, CC14, and to a lesser extent NFa. It is this gas, NF3, which is the topic of this article. The review presents a synopsis of the etching characteristics of material such as Si, SiO:, in NF3 plasmas.
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