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A review of nitrogen trifluoride for dry etching in microelectronics processing

✍ Scribed by Bogdan Golja; John A. Barkanic; Andrew Hoff


Publisher
Elsevier Science
Year
1985
Tongue
English
Weight
804 KB
Volume
16
Category
Article
ISSN
0026-2692

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✦ Synopsis


The development of new gases for dry etching is important if submicron device geometries are to be realized. Gases which are currently in use for the various proce~__sing steps associated with device fabrication include CF4, CF4/O2, SF6, CC14, and to a lesser extent NFa. It is this gas, NF3, which is the topic of this article. The review presents a synopsis of the etching characteristics of material such as Si, SiO:, in NF3 plasmas.


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