A review of nitrogen trifluoride for dry
โ
Bogdan Golja; John A. Barkanic; Andrew Hoff
๐
Article
๐
1985
๐
Elsevier Science
๐
English
โ 804 KB
The development of new gases for dry etching is important if submicron device geometries are to be realized. Gases which are currently in use for the various proce~\_\_sing steps associated with device fabrication include CF4, CF4/O2, SF6, CC14, and to a lesser extent NFa. It is this gas, NF3, which