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A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling

✍ Scribed by Huang, J.; Lai, H.Y.; Qian, Y.Y.; Jiang, Y.H.; Wang, Q.L.

Book ID: 114560351
Publisher: IEEE
Year: 1992
Tongue: English
Weight: 459 KB
Volume: 15
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.159885

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