Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling

✍ Scribed by Tohmyoh, Hironori; Ishikawa, Shoho; Watanabe, Satoshi; Kuroha, Motohisa; Nakano, Yoshikatsu

• Book ID: 122608162
• Publisher: Elsevier Science
• Year: 2013
• Tongue: English
• Weight: 929 KB
• Volume: 53
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2012.08.012