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A dielectrophoretic chip packaged at wafer level

✍ Scribed by Ciprian Iliescu; Francis E. H. Tay; Guolin Xu; Li Ming Yu; Victor Samper

Book ID: 106185031
Publisher: Springer-Verlag
Year: 2006
Tongue: English
Weight: 470 KB
Volume: 12
Category: Article
ISSN: 0946-7076
DOI: 10.1007/s00542-006-0126-y

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