✦ LIBER ✦
Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package
✍ Scribed by S. C. Tseng; R. S. Chen; C. C. Lio
- Book ID
- 105851350
- Publisher
- Springer
- Year
- 2006
- Tongue
- English
- Weight
- 395 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0268-3768
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