✦ LIBER ✦
Wafer-level chip scale packaging for piezoresistive pressure sensors using a dry-film shielding approach
✍ Scribed by Lung-Tai Chen; Wood-Hi Cheng
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 960 KB
- Volume
- 152
- Category
- Article
- ISSN
- 0924-4247
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