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Young's modulus of electroplated Ni thin film for MEMS applications

โœ Scribed by J.K. Luo; A.J. Flewitt; S.M. Spearing; N.A. Fleck; W.I. Milne


Book ID
116730401
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
184 KB
Volume
58
Category
Article
ISSN
0167-577X

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๐Ÿ“œ SIMILAR VOLUMES


Characterization of Young's modulus and
โœ Siyuan He; John S. Chang; Lihua Li; Hsu Ho ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 1005 KB

Metal multi-user MEMS processes (MetalMUMPs) offered by MEMSCAP provide a 20 m thick electroplated nickel film suitable for constructing micro RF tunable capacitors, RF inductors, relays, switches, etc. Currently the Young's modulus and the residual stress gradient of the MetalMUMPs nickel film have