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Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications

✍ Scribed by Oliver Pabst, Michael Schiffer, Ernst Obermeier, Tolga Tekin, Klaus Dieter Lang, Ha-Duong Ngo

Book ID: 113047116
Publisher: Springer-Verlag
Year: 2012
Tongue: English
Weight: 598 KB
Volume: 18
Category: Article
ISSN: 0946-7076
DOI: 10.1007/s00542-011-1419-3

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