✦ LIBER ✦

Void formation at the interface in Sn/Cu solder joints

✍ Scribed by Yang Yang; Hao Lu; Chun Yu; Yongzhi Li

Book ID: 113800504
Publisher: Elsevier Science
Year: 2011
Tongue: English
Weight: 758 KB
Volume: 51
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2011.06.026

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Bi-induced voids at the Cu3Sn/Cu interfa

Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints

✍ P.J. Shang; Z.Q. Liu; D.X. Li; J.K. Shang 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 557 KB

Electromigration-Induced Void Formation

Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich

✍ Shih-Ming Kuo; Kwang-Lung Lin 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 550 KB

Effects of residual S on Kirkendall void

Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints

✍ Jin Yu; J.Y. Kim 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 692 KB

Solder joints of Cu/Sn-3.5Ag were prepared using Cu foil or electroplated Cu films with or without SPS additive. With a high level of SPS in the Cu electroplating bath, voids tended to localize at the Cu/Cu 3 Sn interface during subsequent aging at 150 °C, which was highly detrimental to the drop im

Development of Cu–Sn intermetallic compo

Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface

✍ Xin Ma; Fengjiang Wang; Yiyu Qian; Fusahito Yoshida 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 347 KB

Acceleration of the growth of Cu3Sn void

Acceleration of the growth of Cu3Sn voids in solder joints

✍ Peter Borgesen; Liang Yin; Pericles Kondos 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 857 KB

Additive Effect of Kirkendall Void Forma

Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates

✍ Feng Gao; Hiroshi Nishikawa; Tadashi Takemoto 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 360 KB