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Acceleration of the growth of Cu3Sn voids in solder joints

✍ Scribed by Peter Borgesen; Liang Yin; Pericles Kondos

Book ID: 113800638
Publisher: Elsevier Science
Year: 2012
Tongue: English
Weight: 857 KB
Volume: 52
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2011.12.005

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