✦ LIBER ✦

Suppression effect of Cu and Ag on Cu3Sn layer in solder joints

✍ Scribed by Yu, Chun; Chen, Jie-Shi; Wang, Kai-Yun; Chen, Jing-Qing; Lu, Hao

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructure and Creep Deformation of

✍ Min He; Sylvester N. Ekpenuma; Viola L. Acoff 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 901 KB

Effect of Ag Content on Solidification C

✍ Wei Lu; Yaowu Shi; Yongping Lei 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 453 KB

Undercooling of Sn–Ag–Cu alloys: solder

✍ Hodaj, Fiqiri; Petit, Luc; Baggetto, Loïc; Boisier, Olivier; Verneyre, Lionel 📂 Article 📅 2013 🏛 Carl Hanser Verlag 🌐 English ⚖ 735 KB

Electromigration effect on solder bump i

✍ Kimihiro Yamanaka; Yutaka Tsukada; Katsuaki Suganuma 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 298 KB

Suppression of Cu3Sn and Kirkendall void

✍ Chun Yu; Yang Yang; Peilin Li; Junmei Chen; Hao Lu 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 356 KB

Suppressing Growth of the Cu5Zn8Intermet

✍ R. S. Lai; K. L. Lin; B. Salam 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 462 KB