✦ LIBER ✦
Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich
✍ Scribed by Shih-Ming Kuo; Kwang-Lung Lin
- Publisher
- Springer US
- Year
- 2008
- Tongue
- English
- Weight
- 550 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0361-5235
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