𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Use of thermally stimulated discharge measurements for the investigation of cure and characterization of thermoset-epoxy resins systems

✍ Scribed by J. H. Daly; K. Jeffrey; D. Hayward; R. A. Pethrick; P. Wilford

Publisher
Springer
Year
1993
Tongue
English
Weight
882 KB
Volume
28
Category
Article
ISSN
0022-2461

No coin nor oath required. For personal study only.

✦ Synopsis

Thermally stimulated discharge (TSD) measurements have been used to monitor the cure in thermoset resins and this paper attempts a critical assessment of its application to epoxy resin systems. These studies show that, whilst the method can be used for monitoring cure, there are problems concerned with the detailed interpretation of the TSD data. The observed TSD peaks are complex and associated with charge migration coupled with dipolar reorientation. Data for a wide range of systems and conditions used in cure are discussed.

πŸ“œ SIMILAR VOLUMES

Curing kinetics and thermal property cha
Curing kinetics and thermal property characterization of the bisphenol-F epoxy resin and phthalic anhydride system
✍ Jungang Gao; Hongchi Zhao; Yanfang Li πŸ“‚ Article πŸ“… 2002 πŸ› John Wiley and Sons 🌐 English βš– 118 KB

## Abstract The curing kinetics of bisphenol‐F epoxy resin (BPFER) and curing agent phthalic anhydride, with __N,N__‐dimethylbenzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated autocatalytic behaviour in the first stages of the cure