Curing kinetics and thermal property characterization of the bisphenol-F epoxy resin and phthalic anhydride system

✍ Scribed by Jungang Gao; Hongchi Zhao; Yanfang Li

• Publisher: John Wiley and Sons
• Year: 2002
• Tongue: English
• Weight: 118 KB
• Volume: 51
• Category: Article
• ISSN: 0959-8103
• DOI: 10.1002/pi.1078

✦ Synopsis

Abstract

The curing kinetics of bisphenol‐F epoxy resin (BPFER) and curing agent phthalic anhydride, with N,N‐dimethylbenzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated autocatalytic behaviour in the first stages of the cure for the system, and that this, could be well described by the model proposed by Kamal, which includes two rate constants, k~1~ and k~2~, and two reaction orders, m and n. The curing reaction in the later stages was practically diffusion‐controlled. To consider the diffusion effect more precisely, a diffusion factor, 𝒻(α), was introduced into Kamal's equation. The glass transition temperatures (T~g~s) of the BPFER/phthalic anhydride samples were determined by means of torsional braid analysis. The thermal degradation kinetics of cured BPFER were investigated by thermogravimetric analysis.

© 2002 Society of Chemical Industry