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Ultra-Wideband Power Divider Using Multi-Wafer Packaging Technology

✍ Scribed by Xing Lan; Chang-Chien, P.; Fong, F.; Eaves, D.; Xiang Zeng; Kintis, M.

Book ID
111963177
Publisher
IEEE
Year
2011
Tongue
English
Weight
439 KB
Volume
21
Category
Article
ISSN
1531-1309

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## Abstract A compact three‐way power divider with ultra‐wideband (UWB) performance is presented. The proposed device utilizes a simple and low‐cost broadside‐coupled microstrip‐coplanar waveguide structure. The conformal mapping technique is used to find the dimensions of the device. The simulated

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