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Ultra-precision machining by the cylindrical polishing process

โœ Scribed by Yaw-Terng Su; Tu-Chieh Hung; Chun-Cheng Weng

Book ID
108458126
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
429 KB
Volume
43
Category
Article
ISSN
0890-6955

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The ultra-thin dielectric substrate was obtained by precision grinding and lapping/polishing. In the precision grinding, the substrate was thinned until 50 ฮผm in thickness using fine-grained diamond wheels and a polishing pad. The substrates in the lapping and polishing were thinned to 17 ฮผm in thic