The ultra-thin dielectric substrate was obtained by precision grinding and lapping/polishing. In the precision grinding, the substrate was thinned until 50 ฮผm in thickness using fine-grained diamond wheels and a polishing pad. The substrates in the lapping and polishing were thinned to 17 ฮผm in thic
Ultra-precision machining by the hydrodynamic polishing process
โ Scribed by Yaw-Terng Su; Chuen-Chyi Horng; Shuh-Yi Wang; Shao-Herng Jang
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 1019 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0890-6955
No coin nor oath required. For personal study only.
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