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New glass is precision-machined by chemical process


Publisher
Elsevier Science
Year
1952
Tongue
English
Weight
79 KB
Volume
253
Category
Article
ISSN
0016-0032

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πŸ“œ SIMILAR VOLUMES


Ultra-thinning Processing of Dielectric
✍ M. Touge; J. Watanabe; T. Matsuo πŸ“‚ Article πŸ“… 2006 πŸ› International Academy for Production Engineering 🌐 English βš– 572 KB

The ultra-thin dielectric substrate was obtained by precision grinding and lapping/polishing. In the precision grinding, the substrate was thinned until 50 ΞΌm in thickness using fine-grained diamond wheels and a polishing pad. The substrates in the lapping and polishing were thinned to 17 ΞΌm in thic