Chemical machining as a precision material removal process
β Scribed by P.J. Davis; G.E. Overturf III
- Publisher
- Elsevier Science
- Year
- 1986
- Tongue
- English
- Weight
- 540 KB
- Volume
- 8
- Category
- Article
- ISSN
- 0141-6359
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
So far there is no consensus on the fundamental mechanism of material removal in chemical-mechanical polishing (CMP). Some researchers model the CMP process based on the mechanism proposed by Kaufman et al. [1], who attribute the material removal from the wafer surface to chemistry-aided mechanical
## Abstract Material behaviour that exhibits characteristics of creep induced by a spontaneous mineral dissolution enhanced by material damage is studied. It is believed that the characteristic rates of the chemical processes involved determine the timeβrate dependence of the resulting strain. A ba