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Triple junction and grain boundary diffusion in the Ni/Cu system

โœ Scribed by M.R. Chellali; Z. Balogh; L. Zheng; G. Schmitz

Book ID
113899040
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
456 KB
Volume
65
Category
Article
ISSN
1359-6462

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Grain boundary (GB) diffusion of 63 Ni in polycrystalline Cu was investigated by the radiotracer technique in an extended temperature interval from 476 to 1156 K. The independent measurements in Harrison's C and B kinetic regimes resulted in direct data of the GB diffusivity D gb and of the so-calle