✦ LIBER ✦

Grain boundary diffusion in Ni-Cu multilayer films

✍ Scribed by R. Venos; W. Pamler; H. Hoffmann

Publisher: Elsevier Science
Year: 1988
Tongue: English
Weight: 276 KB
Volume: 162
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(88)90203-9

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Grain Boundary Reactive Diffusion in Ni2

Grain Boundary Reactive Diffusion in Ni2Si Thin Films

✍ Losch, W. ;Acchar, W. 📂 Article 📅 1999 🏛 John Wiley and Sons 🌐 English ⚖ 142 KB 👁 1 views

Surface accumulation and monolayer cover

Surface accumulation and monolayer coverage during grain boundary diffusion in polycrystalline Cu/Ni bilayers

✍ R. Venos; H. Hoffmann 📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 292 KB

Grain boundary diffusion of 63Ni in α-Zr

✍ J.L. Azar; M.J. Iribarren; F. Dyment 📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 386 KB

Copper grain growth in thin film Cu-Cr m

Copper grain growth in thin film Cu-Cr multilayers

✍ U. Admon; I. Dahan; M.P. Dariel; G. Kimmel; J. Sariel; A. Shtechman; B. Yahav; L 📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 443 KB

Ternary diffusion in multilayer Ag-Au-Cu

Ternary diffusion in multilayer Ag-Au-Cu thin films

✍ M. Murakami; D. De Fontaine; J.M. Sanchez; J. Fodor 📂 Article 📅 1975 🏛 Elsevier Science 🌐 English ⚖ 805 KB

Film thickening kinetics by grain bounda

Film thickening kinetics by grain boundary diffusion

✍ J.P. Stark 📂 Article 📅 1984 🏛 Elsevier Science ⚖ 410 KB

A i%m thickening process for a sohd state reaction is considered for the case when the kinetics are limited by grain boundary diffusion. The basis for the reaction is the parabohc rate behavior found to be similar with the bulk diffusion based process to within an excellent approximation. Thus, thic