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An investigation of grain boundary diffusion and segregation of Ni in Cu in an electrodeposited Cu/Ni micro-multilayer system

✍ Scribed by B.P. Shu; L. Liu; Y.D. Deng; C. Zhong; Y.T. Wu; B. Shen; W.B. Hu

Book ID
119322804
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
488 KB
Volume
89
Category
Article
ISSN
0167-577X

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Grain boundary diffusion and segregation
Grain boundary diffusion and segregation of Ni in Cu
✍ Sergiy Divinski; Jens Ribbe; Guido Schmitz; Christian Herzig πŸ“‚ Article πŸ“… 2007 πŸ› Elsevier Science 🌐 English βš– 255 KB

Grain boundary (GB) diffusion of 63 Ni in polycrystalline Cu was investigated by the radiotracer technique in an extended temperature interval from 476 to 1156 K. The independent measurements in Harrison's C and B kinetic regimes resulted in direct data of the GB diffusivity D gb and of the so-calle