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Transfer of thin Si layers by cold and thermal ion cutting

✍ Scribed by K. Henttinen; T. Suni; A. Nurmela; H. V. A. Luoto; I. Suni; V.-M. Airaksinen; S. Karirinne; M. Cai; S. S. Lau

No coin nor oath required. For personal study only.

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