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Transfer of semiconductor and oxide films by wafer bonding and layer cutting

✍ Scribed by Qin-Yi Tong; Li-Juan Huang; Ulich M. Gösele

Book ID: 107452529
Publisher: Springer US
Year: 2000
Tongue: English
Weight: 394 KB
Volume: 29
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-000-0183-4

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